LeapWave
Technologies to Showcase Ultra-Broadband Interconnect Innovations Alongside
Strategic Partners ROHM and NTT Innovative Devices at EuMW
2026
MADRID, SPAIN - August 20, 2026 -
LeapWave Technologies, a pioneer in high-frequency dielectric interconnect
solutions, announces its participation as an exhibitor at the upcoming European
Microwave Week (EuMW) 2026, taking place from October
4th to 9th at the ExCeL Exhibition Centre in London.
Marking a significant milestone in the company's
commercial and technical roadmap, LeapWave will host a live demonstration of
its groundbreaking ultra-broadband technology. The live setup will showcase how
LeapWave enables seamless, ultra-broadband interconnectivity through a single,
highly efficient interface, addressing critical bottlenecks in next-generation
high-frequency communication systems and semiconductor packaging.
Recognizing the vital role of global collaboration in
advancing deep-tech infrastructure, LeapWave will be joined at its booth by its
strategic Japanese partners, ROHM Co.,
Ltd. and NTT Innovative Devices. The co-exhibitor status of
these industry giants highlights a deep, ongoing technical partnership aimed at
accelerating the commercial readiness of high-frequency wireless and packaging
technologies.
"Exhibiting at EuMW
2026 alongside ROHM and NTT Innovative Devices is a testament to the strength
of our international partnerships and the maturity of our technology,"
said Dr. Alejandro Rivera-Lavado, CTO at LeapWave Technologies. "Our joint
presence underscores a shared commitment to overcoming the physical limitations
of conventional RF and electronics. The live demonstration will give the
microwave and RF community a firsthand look at how our single-interface
broadband technology can scale to meet the rigorous demands of future 6G and
sub-THz infrastructure."
Visitors to EuMW 2026 are
invited to experience the live demonstration and meet with technical experts
from LeapWave and ROHM at
Booth # L334.
About LeapWave Technologies:
LeapWave Technologies is a deep-tech company
specializing in the design and development of advanced high-frequency
dielectric interconnect solutions. By bridging the gap between integrated
photonics, RF electronics, and advanced semiconductor packaging, LeapWave
enables high-capacity, low-latency data transmission required for future
communication networks, including 6G and high-frequency wireless infrastructure.
With its proprietary technology, LeapWave is building solutions for broadband
instrumentation.
Contact: Muhsin Ali,
RF Lead, LeapWave Technologies
Email: muhsin.ali@leapwavetech.com
About ROHM Co., Ltd.:
ROHM, a leading semiconductor
and electronic component manufacturer, was established in 1958. From the
automotive and industrial equipment markets to the consumer and communication
sectors, ROHM supplies ICs, discretes, and electronic
components featuring superior quality and reliability through a global sales
and development network.
ROHM is
also committed to contributing to society by inspiring research and
development, enjoying the challenge of the unknown and being the first to
create new cutting-edge products.
Please visit ROHM's website for more information: https://www.rohm.com
Contact: Manivannan Revathi,
researcher, Research & Development Center ROHM Co., Ltd.
Email: revathi.manivannan@rohm.co.jp